Proximity effect compensation in scattering-mask lithographic pr

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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378 34, H01J 37317

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active

055324967

ABSTRACT:
In electron beam lithography, formation of micron and submicron size features is complicated by undesired nonuniform (pattern-density dependent) resist exposure from electrons backscattered from the underlying substrate. The disclosed technique uses a combination of a scattering mask and a scattering filter to add a leveling background exposure automatically and thus provide uniform contrast across the entire exposure pattern.

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patent: 5097138 (1992-03-01), Wakabayashi et al.
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