Providing high precision resistance in an integrated circuit...

Details Providing high precision resistance in an integrated circuit... Providing high precision resistance in an integrated circuit...

2006-02-28

2006-02-28

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Making passive device

Resistor

Reexamination Certificate

active

07005361

ABSTRACT:
In one embodiment, an integrated circuit includes a thin film resistor, which includes a resistor material that has been deposited on a substrate surface within a channel defined by opposing first and second portions of a stencil structure formed on the substrate surface, the resistor material having an initial width determined by a width of the channel. The stencil structure has been adapted to receive a planarizing material that protects against reduction of the initial width of the resistor material during subsequent process steps for removing the stencil structure. A head mask overlays an end portion of the thin film resistor and a dielectric overlays the head mask, the dielectric defining a via formed in the dielectric above a portion of the head mask. A conductive material has been deposited in the via, coupled to the portion of the head mask and electrically connecting the thin film resistor to other components of the integrated circuit.

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