Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2003-07-30
2009-12-01
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S764000, C361S766000
Reexamination Certificate
active
07626828
ABSTRACT:
A circuit board includes reference plane layers and a dielectric between the reference plane layers. A resistive element is also provided between the reference plane layers to provide a resistive path between the reference plane layers. Optimally, a decoupling capacitor is provided having a first electrode electrically connected to the resistive element, and a second electrode electrically connected to one of the reference plane layers.
REFERENCES:
patent: 3749971 (1973-07-01), Petty
patent: 4436953 (1984-03-01), Gottlieb
patent: 4720766 (1988-01-01), Honda
patent: 4777718 (1988-10-01), Henderson et al.
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5261153 (1993-11-01), Lucas
patent: 5652562 (1997-07-01), Riley
patent: 5757076 (1998-05-01), Kambara
patent: 5796587 (1998-08-01), Lauffer et al.
patent: 5953203 (1999-09-01), Tormey et al.
patent: 6043973 (2000-03-01), Nagashima et al.
patent: 6068782 (2000-05-01), Brandt et al.
patent: 6153290 (2000-11-01), Sunahara
patent: 6198362 (2001-03-01), Harada et al.
patent: 6215372 (2001-04-01), Novak
patent: 6256850 (2001-07-01), Lauffer et al.
patent: 6329590 (2001-12-01), Alexander et al.
patent: 6407929 (2002-06-01), Hale et al.
patent: 6611419 (2003-08-01), Chakravorty
patent: 6737749 (2004-05-01), Tomsio et al.
Precision Resistor Networks, Resistors Advanced Information, Honeywell.
Configurating a Discrete Resistor Verification Test System, Keithly Instrument Inc.
U.S. Appl. No. 10/287,116, filed Nov. 4, 2002, Jun Fan et al.
U.S. Appl. No. 10/670,829, filed Nov. 4, 2002, Jun Fan et al.
Chip Scale Review, “Embedded Capacitors Improve Overall Device Performance,” pp. 1-2, printed from website http://www.chipscalereview.com/isues/0802/patents.html (Aug.-Sep. 2002).
Alexander Arthur R.
Fan Jun
Knighten James L.
Smith Norman W.
Dinh Tuan T
Stevens Harden E.
Teradata , US Inc.
Trop Pruner & Hu
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