Providing a PGA package with a low reflection line

Details Providing a PGA package with a low reflection line Providing a PGA package with a low reflection line

1989-12-19

1991-04-30

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

357 74, 361403, 361421, H01P 500

Patent

active

050122134

ABSTRACT:
A conventional pin grid array package is provided with microwave frequency signal lines by wire bonding two adjacent conductive lines together. The wire bonding process is done at the same time that a semiconductor device is electrically connected to the pin grid array package. The two adjacent wire bonded conductive lines will have very low reflection or signal loss and therefore can be used with signals having a fast rise time or fast edge rates. The wire bond connection does not significantly degrade a constant impedance line for the signal.

REFERENCES:
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4580193 (1986-04-01), Edwards
patent: 4593243 (1986-06-01), Lao et al.
patent: 4853624 (1989-08-01), Rabjohn
patent: 4907129 (1990-03-01), Shimizu

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