Protosubstrates

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C977S721000, C977S722000, C977S723000, C977S724000

Reexamination Certificate

active

10444061

ABSTRACT:
The invention provides a nanolithographic protosubstrate adapted for nanolithographic formation of nanostructures on the protosubstrate comprising: a substrate having a top surface exposed for nanolithographic formation of nanostructures, wherein the top surface comprises: electrically insulating surface regions; and at least one discreet electrode topology surrounded by the electrically insulating surface regions, wherein the electrode topology is adapted with electrical interconnections for electrically coupling the electrode topology to an external device.

REFERENCES:
patent: 4130334 (1978-12-01), Anderson
patent: 4833404 (1989-05-01), Meyer et al.
patent: 4854039 (1989-08-01), Wendt
patent: 4862076 (1989-08-01), Renner et al.
patent: 4949453 (1990-08-01), Neumann
patent: 4978912 (1990-12-01), Vonder
patent: 4991287 (1991-02-01), Piatt
patent: 5090121 (1992-02-01), Gaddis
patent: 5122620 (1992-06-01), Neumann
patent: 5226824 (1993-07-01), Karlovich
patent: RE34395 (1993-10-01), Neumann
patent: 5258576 (1993-11-01), Neumann
patent: 5362669 (1994-11-01), Boyd et al.
patent: 5426738 (1995-06-01), Hsieh
patent: 5665618 (1997-09-01), Meyer et al.
patent: 5686699 (1997-11-01), Chu et al.
patent: 5728507 (1998-03-01), Rhoades
patent: 5734560 (1998-03-01), Kamperman et al.
patent: 5780358 (1998-07-01), Zhou et al.
patent: 5972798 (1999-10-01), Jang et al.
patent: 6043563 (2000-03-01), Elridge
patent: 6131275 (2000-10-01), Eriksson
patent: 6140710 (2000-10-01), Greenberg
patent: 6215196 (2001-04-01), Elridge
patent: 6325904 (2001-12-01), Peeters
patent: 6358816 (2002-03-01), Singh
patent: 6366107 (2002-04-01), Swart
patent: 6391792 (2002-05-01), Jang et al.
patent: 6429458 (2002-08-01), Weigold et al.
patent: 6433423 (2002-08-01), Bergstedt
patent: 6452406 (2002-09-01), Beaman et al.
patent: 6468891 (2002-10-01), Williams
patent: 6509207 (2003-01-01), Liu
patent: 6524123 (2003-02-01), Kedrowski
patent: 6555415 (2003-04-01), Hedler et al.
patent: 6559523 (2003-05-01), Schmid et al.
patent: 6561411 (2003-05-01), Lee
patent: 6563225 (2003-05-01), Soga et al.
patent: 6619785 (2003-09-01), Sato
patent: 6635311 (2003-10-01), Mirkin et al.
patent: 6642129 (2003-11-01), Liu et al.
patent: 6644117 (2003-11-01), Kueck et al.
patent: 6673532 (2004-01-01), Rao
patent: 6674074 (2004-01-01), Schwartz et al.
patent: 6737646 (2004-05-01), Schwartz et al.
patent: 6751856 (2004-06-01), Kedrowski
patent: 6827979 (2004-12-01), Mirkin et al.
patent: 6829749 (2004-12-01), Osaka
patent: 2002/0061662 (2002-05-01), Boggild
patent: 2002/0122373 (2002-09-01), Marshall
patent: 2002/0122873 (2002-09-01), Mirkin et al.
patent: 2003/0068446 (2003-04-01), Mirkin et al.
patent: 2003/0123199 (2003-07-01), Honda et al.
patent: 2003/0162004 (2003-08-01), Mirkin et al.
patent: 2003/0185967 (2003-10-01), Eby et al.
patent: 2004/0045738 (2004-03-01), Sugawa et al.
patent: 2267997 (1993-12-01), None
patent: WO 00/41213 (2000-07-01), None
patent: WO 01/91855 (2001-12-01), None
International Search Report dated Mar. 12, 2003.
U.S. Appl. No. 10/307,515, filed Dec. 2, 2002, Mirkin et al.
U.S. Appl. No. 10/375,060, filed Feb. 28, 2003, Dupeyrat et al.
Madou,Fundamentals of Microfabrication, The Science of Miniaturization, Second Edition, CRC Press, USA, Chapters 1, 2, 3, & pp. 602-604, (2002).

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