Protective thin films for use during fabrication of...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal

Reexamination Certificate

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C438S051000, C438S055000, C438S064000, C438S068000, C257SE21001

Reexamination Certificate

active

08067258

ABSTRACT:
A method of protecting a substrate during fabrication of semiconductor, MEMS, or biotechnology devices. The method includes application of a protective thin film which typically has a thickness ranging from about 3 Å to about 1,000 Å, wherein precursor materials used to deposit the protective thin film are organic-based precursors which include at least one fluorine-comprising functional group at one end of a carbon back bone and at least one functional bonding group at the opposite end of a carbon backbone, and wherein the carbon backbone ranges in length from 4 carbons through about 12 carbons. In many applications at least a portion of the protective thin film is removed during fabrication of the devices.

REFERENCES:
patent: 5527744 (1996-06-01), Mignardi et al.
patent: 6806993 (2004-10-01), Adams et al.
patent: 6979893 (2005-12-01), Dunphy et al.
patent: 7009745 (2006-03-01), Miller et al.
patent: 2004/0261703 (2004-12-01), Kobrin et al.
patent: 2005/0012975 (2005-01-01), George et al.
patent: 2005/0260793 (2005-11-01), Patel et al.
patent: 2006/0007515 (2006-01-01), Simonian et al.
patent: 2006/0038269 (2006-02-01), Dunphy et al.
patent: 2007/0232062 (2007-10-01), Nogami
patent: 2008/0032403 (2008-02-01), Saito et al.
patent: 2004-261216 (2004-09-01), None
patent: WO2006028274 (2006-03-01), None
W.R. Ashurst et al., “Vapor Phase Anti-Stiction Monolayer Coatings for MEMS”, TDMR-Draft, pp. 1-6 (Sep. 2003).
C.F. Herriman et al., “Hydrophobic Coatings Using Atomic Layer Deposition and Non-Chlorinated Precursors”, 0-7803-8265-X/04 © 2004 IEEE.
M. G. Hankins, “Vapor Deposition of Amino-Functionalized Self-Assembled Monolayers on MEMS”, Reliability, Testing, and Characterization of MEMS/MOEMS, Proceedings of SPIE, vol. 4980, pp. 238-247 (2003).

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