Protective tape separation method and apparatus using the same

Details Protective tape separation method and apparatus using the same Protective tape separation method and apparatus using the same

2008-09-19

2011-11-22

Nguyen, Khanh P (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Delaminating, per se; i.e., separating at bonding face

C156S751000

Reexamination Certificate

active

08062474

ABSTRACT:
A surface height of a protective tape joined to a wafer mounted and held on a separation table is detected, a lowering operation distance of a needle is calculated based on such detected information, and a lowering operation amount for approaching a joining member to the protective tape until the separation tape winded around the joining member contacts the protective tape is calculated. A separating site is formed in the protective tape and the protective tape is separated while controlling a height of each member based on the calculated lowering operation amount.

REFERENCES:
patent: 2002/0173229 (2002-11-01), Kobayashi
patent: 2006/0219359 (2006-10-01), Miyamoto et al.
patent: 2007/0119543 (2007-05-01), Ametani
patent: 2007/0207629 (2007-09-01), Ametani
patent: 2007/0284038 (2007-12-01), Yamamoto et al.
patent: 02125440 (1990-05-01), None
patent: 05-063077 (1993-03-01), None
The First Office Action for the Applicatin No. 200810148856.8 from the State Intellectual Property Office of People's Republic of China dated Aug. 8, 2011.

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