Protective tape separation method, and apparatus using the same

Details Protective tape separation method, and apparatus using the same Protective tape separation method, and apparatus using the same

2005-08-03

2008-11-25

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With bond interfering means

C156S247000, C156S289000, C156S345420, C156S583200

Reexamination Certificate

active

07455095

ABSTRACT:
The invention relates to an apparatus for separating a protective tape joined to a semiconductor wafer. Before joining a separation tape to a protective tape on a surface of a semiconductor wafer held, from its back side, by a ring frame via a dicing tape while pressing the separation tape against the protective tape with the use of an edge member, pure water is dropped from a piston nozzle onto the back side of the dicing tape located in front of a joining start end of the separation tape.

REFERENCES:
patent: 5009735 (1991-04-01), Ametani et al.
patent: 5891298 (1999-04-01), Kuroda et al.
patent: 6716295 (2004-04-01), Yamamoto
patent: 7172673 (2007-02-01), Kurosawa et al.
patent: 2007/0119543 (2007-05-01), Ametani
patent: 2007/0169895 (2007-07-01), Kobayashi et al.
patent: 2007/0235131 (2007-10-01), Tsujimoto et al.
patent: WO-97/08745 (1997-03-01), None

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