1986-11-28
1988-02-23
Edlow, Martin H.
357 52, 357 48, 357 231, 357 68, H01L 2978, H01L 2704, H01L 2934
Patent
active
047274050
ABSTRACT:
For decreasing a leakage current, there is disclosed a protective network fabricated on a semiconductor substrate for preventing a protected node from a destruction comprising, a semiconductor substrate of a first conductivity type, an insulating film overlying the semiconductor substrate, a first impurity region of a second conductivity type formed in the semiconductor substrate and providing a signal path with a relatively large resistance value electrically connected at a contact portion thereof to the protected node, the signal path having an upstream portion and a downstream portion providing between the contact portion and the upstream side portion, a second impurity region of the second conductivity type formed in the semiconductor substrate and electrically connected to a constant voltage source, a separating region defined in the semiconductor substrate and intervening between a part of the first impurity region and the second impurity region for causing the part of the first impurity region to be spaced apart from the second impurity region, the part of the first impurity region providing a part of the upstream portion and the downstream portion, and an input electrode formed on said insulating film and electrically connected to the upstream portion of the signal path through the insulating film for propagation of an external signal applied thereto, the input electrode extending over a part of the separating region contiguous only to the downstream side portion of the signal path.
REFERENCES:
patent: 4688065 (1987-08-01), Kinoshita et al.
Edlow Martin H.
Featherstone D.
NEC Corporation
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