Protective member for semiconductor wafer

Details Protective member for semiconductor wafer Protective member for semiconductor wafer

1997-01-07

1999-10-05

Ahmad, Nasser

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

283 81, 428 413, 428 415, 428 417, 428 418, 428 422, 428 423, 428516, B32B 706

Patent

active

059620978

ABSTRACT:
A protective member for a semiconductor wafer wherein a pressure-sensitive adhesive layer formed on a protective film is temporarily adhered to a separator comprising a reinforcing layer and a cover layer, through the cover layer. The separator of the protective member does not require a surface treatment with a release agent and in processing a semiconductor wafer, such as back-surface grinding, the protective film can be automatically peeled and is adhered to the semiconductor wafer via an automatic adhering apparatus to enable the desired processing.

REFERENCES:
patent: 3655496 (1972-04-01), Ettre
patent: 5167995 (1992-12-01), Johnson

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