Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent
1992-01-14
1993-03-09
Padgett, Marianne
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
426 96, 426 98, 156628, 156646, 156656, B05D 306, B05D 512, H01L 21306
Patent
active
051925818
ABSTRACT:
A dielectric substrate is coated with a protective layer and a catalyst film is formed in a laser irradiated predetermined pattern on the protective layer so that during electroless deposition a metal is plated on the catalyst film in the predetermined pattern whether or not the dielectric has unwanted catalytic sites. The protective layer is not removed by the electroless plating bath or prior etch steps but can subsequently be stripped by a separate etch without removing the plated metal or the dielectric from the substrate.
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Hirsch Tom J.
Lee Chung J.
Lin Charles W. C.
Muller Heinrich G. O.
Microelectronics and Computer Technology Corporation
Padgett Marianne
Sigmond David M.
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