Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-12-16
2000-07-11
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361707, 361709, 361710, 361719, 361752, 361759, 165 802, 165 803, 165185, 174 161, 174 163, H05K 720
Patent
active
06088228&
ABSTRACT:
A heat dissipating element, positioned inside a protective cover, removes heat from the vicinity of a multi-chip module comprising active semiconductor devices attached to a printed circuit board. Attachment of the protective cover to the printed circuit board uses a latching mechanism with minimum board space requirements.
REFERENCES:
patent: 4409641 (1983-10-01), Jakob et al.
patent: 4492878 (1985-01-01), Hamel
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5109318 (1992-04-01), Funari et al.
patent: 5129833 (1992-07-01), Rowlette, Sr.
patent: 5208733 (1993-05-01), Besanger
patent: 5243131 (1993-09-01), Jakob et al.
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5353194 (1994-10-01), Libretti et al.
patent: 5548090 (1996-08-01), Harris
patent: 5699229 (1997-12-01), Brownell
patent: 5754400 (1998-05-01), Sathe et al.
patent: 5761046 (1998-06-01), Hein et al.
patent: 5777847 (1998-07-01), Tokuno et al.
Harper David L.
Petersen Kurt H.
3M Innovative Properties Company
Ball Alan
Chervinsky Boris H.
McNutt Matthew B.
Picard Leo P.
LandOfFree
Protective enclosure for a multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Protective enclosure for a multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Protective enclosure for a multi-chip module will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-548235