Protection structure for thermal conducting medium of heat...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S708000, C165S185000, C257S707000

Reexamination Certificate

active

07068514

ABSTRACT:
A protection structure for a thermal conducting medium of a heat dissipation structure installed on the heat dissipation device at the position on which the thermal conducting medium is coated. The protection structure has a bottom surface to cover the thermal conducting medium, a side wall extending along and projecting from a periphery of the bottom surface to form a space for receiving the thermal conducting medium and a portion of the heat dissipation device, and a support structure protruding from the bottom surface to avoid a direct contact between the thermal conducting medium and the bottom surface.

REFERENCES:
patent: 6029740 (2000-02-01), Lee et al.
patent: 6049458 (2000-04-01), Lee et al.
patent: 6059116 (2000-05-01), Hinshaw et al.
patent: 6935420 (2005-08-01), Dong et al.
patent: 6952348 (2005-10-01), Wu
patent: 2003/0075312 (2003-04-01), Panek
patent: 2003/0123228 (2003-07-01), Bhatia et al.
patent: 2003/0150770 (2003-08-01), Campbell et al.

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