Protecting thin semiconductor wafers during back-grinding in...

Details Protecting thin semiconductor wafers during back-grinding in... Protecting thin semiconductor wafers during back-grinding in...

2007-03-06

2007-03-06

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S459000, C257S678000, C257S687000, C257S703000, C257S794000, C257SE23127, C428S425500

Reexamination Certificate

active

10716992

ABSTRACT:
A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 μm, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.

REFERENCES:
patent: 5246737 (1993-09-01), Muradov
patent: 5705016 (1998-01-01), Senoo et al.
patent: 6911358 (2005-06-01), Azami et al.
patent: 6946236 (2005-09-01), Rottstegge et al.
patent: 2005/0064681 (2005-03-01), Wood et al.
PCT International Search Report dated Nov. 8, 2005, PCT/US04/36742.
PCT Written Opinion of ISA dated Nov. 8, 2005, PCT/US04/36742.

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