Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Reexamination Certificate
2006-10-24
2006-10-24
Tsai, H. Jey (Department: 2812)
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
C361S523000, C361S535000
Reexamination Certificate
active
07125429
ABSTRACT:
A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
REFERENCES:
patent: 4594641 (1986-06-01), Hernandez
patent: 5640746 (1997-06-01), Knecht et al.
patent: 6229687 (2001-05-01), Wada et al.
patent: 6235842 (2001-05-01), Kuwano et al.
patent: 6236561 (2001-05-01), Ogino et al.
patent: 6324051 (2001-11-01), Igaki et al.
patent: 6370016 (2002-04-01), Stevens
patent: 6686095 (2004-02-01), Hayase et al.
Chen Qingping
Harrington Albert Kennedy
Kinard John Tony
Lessner Phillip Michael
Melody Brian John
Guy Joseph T.
Kemet Electronics Corporation
Nexsen Pruet , LLC
Tsai H. Jey
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