Protecting film for wafer and method for grinding surface of waf

Details Protecting film for wafer and method for grinding surface of waf Protecting film for wafer and method for grinding surface of waf

1995-11-09

1997-02-11

Powell, William

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

Removing at least one of the self-sustaining preforms or a...

216 52, 216 90, 1566311, 1566451, 1566371, 156345, 134 34, B44C 122

Patent

active

056017324

ABSTRACT:
Upon grinding a back of a substrate, a protecting tape made of a material soluble to IPA (isopropanol), for example, a vinyl acetate thermoplastic adhesive is appended on the surface of a pattern-formed layer of a wafer, grinding the back, dipping the wafer in a cleaning vessel containing IPA, and dissolving and removing the protecting tape from the wafer, thereby giving no damages to the wafer, and reducing the number of operation steps.

REFERENCES:
patent: 4246054 (1981-01-01), Nester
patent: 5209815 (1993-05-01), Fleming et al.

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