Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-01-21
1996-01-30
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
228215, 228222, 361767, 361807, H05K 720
Patent
active
054885396
ABSTRACT:
A method and apparatus is disclosed for protecting a solder pad for a chip on tape packaged integrated circuit mounted on a surface of a printed circuit board that is exposed to a wave soldering operation. A pad cover may be used to protect the solder pad. The pad cover is mounted over the solder pad in a manner that protects the solder pad from being exposed to solder during the wave solder operation. After the wave solder is completed, the cover is removed and the leads of the chip on tape packaged integrated circuit are connected to associated solder pad traces on the printed circuit board. This type of arrangement is particularly useful in arrangements which require a heat sink to cool the chip on tape packaged integrated circuit.
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Horstmann Jens
Siahpolo Hassan
Testa James F.
Sun Microsystems Inc.
Thompson Gregory D.
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