Proportional micromechanical valve

Fluid-pressure and analogous brake systems – Speed-controlled – Having a valve system responsive to a wheel lock signal

Reexamination Certificate

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Details

C303S116100, C137S014000, C251S011000, C251S129060, C251S129070, C251S368000

Reexamination Certificate

active

07011378

ABSTRACT:
The present invention provides a proportional microvalve having a first, second and third layer, and having high aspect ratio geometries. The first layer defines a cavity with inlet and outlet ports. The second layer, doped to have a low resistivity and bonded between the first and third layers, defines a cavity having a flow area to permit fluid flow between the inlet and outlet ports. The second layer further defines an actuatable displaceable member, and one or more thermal actuators for actuating the displaceable member to a position between and including an open and a closed position to permit or occlude fluid flow. The third layer provides one wall of the cavity and provides electrical contacts for electrically heating the thermally expandable actuators. The thermal actuators and the displaceable member have high aspect ratios and are formed by deep reactive ion etching such that they are displaceable in the plane of the second layer while being very stiff out of the plane. Thus, both actuation and displacement of the displaceable member are in the plane of the layer.

REFERENCES:
patent: 886045 (1908-04-01), Ehrlich et al.
patent: 1886205 (1932-11-01), Lyford
patent: 1926031 (1933-09-01), Boynton
patent: 2412205 (1946-12-01), Cook
patent: 2504055 (1950-04-01), Thomas
patent: 2840107 (1958-06-01), Campbell
patent: 2875779 (1959-03-01), Campbell
patent: 3031747 (1962-05-01), Green
patent: 3729807 (1973-05-01), Fujiwara
patent: 3747628 (1973-07-01), Holster et al.
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 4005454 (1977-01-01), Froloff et al.
patent: 4019388 (1977-04-01), Hall, II et al.
patent: 4023725 (1977-05-01), Ivett et al.
patent: 4152540 (1979-05-01), Duncan et al.
patent: 4181249 (1980-01-01), Peterson et al.
patent: 4298023 (1981-11-01), McGinnis
patent: 4341816 (1982-07-01), Lauterbach et al.
patent: 4434813 (1984-03-01), Mon
patent: 4581624 (1986-04-01), O'Connor
patent: 4628576 (1986-12-01), Giachino et al.
patent: 4647013 (1987-03-01), Giachino et al.
patent: 4661835 (1987-04-01), Gademann et al.
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4821997 (1989-04-01), Zdeblick
patent: 4824073 (1989-04-01), Zdeblick
patent: 4826131 (1989-05-01), Mikkor
patent: 4828184 (1989-05-01), Gardner et al.
patent: 4869282 (1989-09-01), Sittler et al.
patent: 4938742 (1990-07-01), Smits
patent: 4943032 (1990-07-01), Zdeblick
patent: 4959581 (1990-09-01), Dantlgraber
patent: 4966646 (1990-10-01), Zdeblick
patent: 5029805 (1991-07-01), Albarda et al.
patent: 5037778 (1991-08-01), Stark et al.
patent: 5050838 (1991-09-01), Beatty et al.
patent: 5054522 (1991-10-01), Kowanz et al.
patent: 5058856 (1991-10-01), Gordon et al.
patent: 5061914 (1991-10-01), Busch et al.
patent: 5064165 (1991-11-01), Jerman
patent: 5065978 (1991-11-01), Albarda et al.
patent: 5066533 (1991-11-01), America et al.
patent: 5069419 (1991-12-01), Jerman
patent: 5074629 (1991-12-01), Zdeblick
patent: 5082242 (1992-01-01), Bonne et al.
patent: 5096643 (1992-03-01), Kowanz et al.
patent: 5116457 (1992-05-01), Jerman
patent: 5131729 (1992-07-01), Wetzel
patent: 5133379 (1992-07-01), Jacobsen et al.
patent: 5142781 (1992-09-01), Mettner et al.
patent: 5161774 (1992-11-01), Engelsdorf et al.
patent: 5169472 (1992-12-01), Goebel
patent: 5176358 (1993-01-01), Bonne et al.
patent: 5177579 (1993-01-01), Jerman
patent: 5178190 (1993-01-01), Mettner
patent: 5179499 (1993-01-01), MacDonald et al.
patent: 5180623 (1993-01-01), Ohnstein
patent: 5197517 (1993-03-01), Perera
patent: 5209118 (1993-05-01), Jerman
patent: 5215244 (1993-06-01), Buchholz et al.
patent: 5216273 (1993-06-01), Doering et al.
patent: 5217283 (1993-06-01), Watanabe
patent: 5238223 (1993-08-01), Mettner et al.
patent: 5244537 (1993-09-01), Ohnstein
patent: 5267589 (1993-12-01), Watanabe
patent: 5271431 (1993-12-01), Mettner et al.
patent: 5271597 (1993-12-01), Jerman
patent: 5309943 (1994-05-01), Stevenson et al.
patent: 5325880 (1994-07-01), Johnson et al.
patent: 5333831 (1994-08-01), Barth et al.
patent: 5336062 (1994-08-01), Richter
patent: 5355712 (1994-10-01), Petersen et al.
patent: 5368704 (1994-11-01), Madou et al.
patent: 5375919 (1994-12-01), Furuhashi
patent: 5400824 (1995-03-01), Gschwendtner et al.
patent: 5417235 (1995-05-01), Wise et al.
patent: 5445185 (1995-08-01), Watanabe et al.
patent: 5458405 (1995-10-01), Watanabe
patent: 5553790 (1996-09-01), Findler et al.
patent: 5556703 (1996-09-01), Gross
patent: 5577533 (1996-11-01), Cook, Jr.
patent: 5785295 (1998-07-01), Tsai
patent: 5810325 (1998-09-01), Carr
patent: 5838351 (1998-11-01), Weber
patent: 5848605 (1998-12-01), Bailey et al.
patent: 5873385 (1999-02-01), Bloom et al.
patent: 5909078 (1999-06-01), Wood et al.
patent: 5926955 (1999-07-01), Kober
patent: 5941608 (1999-08-01), Campau et al.
patent: 6019437 (2000-02-01), Barron et al.
patent: 6105737 (2000-08-01), Weigert et al.
patent: 6523560 (2003-02-01), Williams et al.
patent: 2215526 (1973-10-01), None
patent: 2930779 (1980-02-01), None
patent: 3401404 (1985-07-01), None
patent: 4101575 (1992-07-01), None
patent: 4417251 (1995-11-01), None
patent: 4422942 (1996-01-01), None
patent: 0250948 (1988-01-01), None
patent: 0261972 (1988-03-01), None
patent: 2238267 (1991-05-01), None
patent: WO 99/16096 (1999-04-01), None
Klaassen et al, “Silicon Fusion Bonding and DeepReactive Ion Etching; A New Technology For Microstructures” Proc. Transducers 95 Stockholm Sweden pp. 556-559.
Author Unkwown. (Sep./Oct. 1999). “HiTecMetal Group Develops Niche Market for Brazed Laminated Assemblies,”Fluid Power Journal27.
Ayón, A.A. et al. (Jun. 1998). “Etching Characteristics and Profile Control in a Time-Multiplexed ICP Etcher,”Proc. of Solid State Sensor and Actuator Workshop Hilton Head SCpp. 41-44.
Bartha, J.W., et al., (1995). “Low Temperature Etching of Si in High Density Plasma Using SF6/O2l ,”Microelectronic Engineering,27:453-456.
Carpenter Technology Corporation Tehcnical Data sheet for “Carpenter Low Expansion ;42”, date Nov. 1980 <http://www.carpenter.idensinc.com/datasheet.asp?e=181&u=eVIEW=PRINTER> (visited on Mar. 28, 2002).
Delphi Automotive Systems product brochure (1997). Variable Bleed Solenoid (VBS) for Transmission, copyright 1997.
Delphi Automotive Systems product brochure (1998). On/Off Transmission Solenoids, copyright 1998.
Duffy, James E. (1994). “Automatic Transmission Fundamentals,” Modern Automotive Technology, copyright 1994, p. 707.
Fung, C.D., et al. (Nov. 7-8, 1984). “Deep Etching of Silicon Using Plasma,”Proceedings of the Workshop on Micromachining and Micropackaging of Transducers,pp. 159-164.
Houston, P. N. et al. (Jun. 1-4, 1999). “Low Cost Flip Chip Processing and Reliability of Fast-Flow, Snap-Cure Underfills,” 1999 Electronic Components and Technology Conference. San Diego, CA, pp. 61-70.
Jonsmann, J. et al. (Jan. 17-21, 1999). “Compliant Electro-thermal Microactuator”Twelfth IEEE International Conference on Mico Electro Mechanical SystemsOrlando, Florida, IEEE Technical Digest entitled IEEE Catalog No.: 99CH36291C pp. 588-593.
Klaasen E.H. et al.(1995). “Silicon Fusion Bonding and Deep Reactive Ion Etching; A New Technology for Microstructures,”Proc. Tranducers 95 Stockholm Swedenpp. 556-559.
Konarski, Mark M. (May 31 to Jun. 4, 1998). “Cure Parameter Effects on the Tg and CTE of Flip Encapsulants,”43rd International SAMPE Symposium and Exhibition. Materials and Process Affordability. Keys to the Future.Anaheim, CA, vol. 1 pp. 823-832.
Linder, C. et al. (Jun. 1991). “Deep Dry Etching Techniques as a new IC Compatible Tool for Silicon Micromachining,”Proceedings, Transducers '91pp. 524-527.
Madou, Marc (1997). “Scaling Laws, Actuators, and Power in Miniaturization,” Chapter 9In Fundamentals of MicrofabricationCRC Press LLC: Boca Raton, FL., pp. 405-446.
Noworolski, J.M. et al., (1996) “Process for in plane-and out-of-plane single crystal-silicon thermal conductors”Sensors an

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