Projection-exposure method for manufacturing semiconductor devic

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430311, G03F 900

Patent

active

058886761

ABSTRACT:
Methods are disclosed for forming, on a semiconductor substrate, a circuit pattern of semiconductor device having a die (field) size larger than the irradiation field achievable using a particular photolithographic exposure system. The circuit pattern is defined by a reticle, but the reticle field is divided into multiple subfields that are projection-exposed onto the substrate in a sequential manner to form, for each die formable on the substrate, the complete circuit pattern in which the subfields are adjacent and aligned with each other. The subfields on the reticle have at least one non-linear boundary to increase the packing density of individual devices of the circuit on the substrate. For example, the non-linear boundaries can be dentate or serpentine. An exemplary application of the method is disclosed for making an image-pickup device for HDTV.

REFERENCES:
patent: 5523580 (1996-06-01), Davis
patent: 5674413 (1997-10-01), Pfeiffer et al.

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