Projection exposure apparatus

Photocopying – Projection printing and copying cameras – With temperature or foreign particle control

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Details

355 53, 355 55, G03B 2752, G03B 2742

Patent

active

049890310

ABSTRACT:
A projection exposure apparatus used for the purpose of forming extremely fine patterns, e.g., semiconductor integrated circuits on a wafer. The apparatus includes an illuminating optical system for irradiating a reticle with light emitted from a light source, a projection optical system for projecting an image of the reticle onto a wafer which is to be exposed, a first chamber for enclosing the projection exposure apparatus on the whole, a second chamber arranged inside the first chamber to enclose a space containing an optical path of an exposure light between the projection optical system and the wafer, and means for separately adjusting internal air temperatures of the first and second chambers.

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