Projection aligner and method of positioning a wafer

Details Projection aligner and method of positioning a wafer Projection aligner and method of positioning a wafer

1979-10-22

1981-11-03

Wintercorn, Richard A.

Photocopying

Projection printing and copying cameras

Focus or magnification control

355 77, 355 53, G03B 2752

Patent

active

042982731

ABSTRACT:
A wafer projection aligner comprises an optical system for projecting a radiation pattern onto a surface of a semiconductor wafer and a wafer position setting apparatus for positioning the wafer at a position within a focal depth of the optical system for allowing printing of a fine pattern on the wafer. The wafer position setting apparatus includes paralleling means provided with three leveling pads defining a reference plane, air micrometers having a plurality of nozzles opened at least in the vicinity of respective ones of the leveling pads for measuring the distance between the wafer surface and the reference plane in a non-contacting manner, wafer leveling mechanism having a semispherical seat member for holding the wafer and adapted to be vertically movable between the reference plane and the focal plane, and control apparatus for controlling the wafer leveling mechanism so that a focal plane of the wafer is set on the basis of the measured convexity or concavity of the wafer surface as measured by air micrometer, when the parallelism of the wafer as measured by the air micrometer lies within a predetermined standard range.

REFERENCES:
patent: 3260153 (1966-07-01), Abbott, Jr. et al.
patent: 3704657 (1972-12-01), Sliwkowski et al.
patent: 4084903 (1978-04-01), Pircher
patent: 4093378 (1978-06-01), Horr et al.
patent: 4140392 (1979-02-01), Lacombat et al.
patent: 4155642 (1979-05-01), Lacombat
patent: 4179110 (1979-12-01), Kosugi et al.
patent: 4198159 (1980-04-01), Cachon
patent: 4239381 (1980-12-01), Lacombat et al.

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