Projecting exposure apparatus and method of exposing a circuit s

Photocopying – Projection printing and copying cameras – Illumination systems or details

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H01L 2130

Patent

active

H00017744

ABSTRACT:
A scanning projection exposure apparatus having a projection optical system (11), for serially transferring a pattern on a reticle (7) onto a wafer (12). The exposure apparatus control the position and/or the tilt angle of the wafer (12) such that the surface of the wafer (12) may be continuously adjusted during the scanning exposure operation so as to be coincident with an image plane of the projection optical system (11), with a high tracking accuracy, even when the image plane of the projection optical system (11) tends to vary during the scanning exposure operation. An image of that portion of the pattern on the reticle (7) which is confined in an illumination area (8) is formed in a plane through the projection optical system. This plane is used as a first reference plane (62). Parameters of the first reference plane (62) such as the tilt angle .theta..sub.p are determined by measurement. An image plane is defined by conjugate images (formed on the wafer side) of the points passing the center of the illumination area (8) when the reticle (7) is moved for scanning in the X-direction. This image plane is used as a second reference plane (65). The tilt angle .THETA..sub.x of the second reference plane (65) is determined by measurement. When the scanning exposure operation is performed, the tilt angle of the illumination field (13) of the wafer (12) is made coincident with that of the first reference plane (62), and the focusing position of the wafer (12) is made coincident with that of the second reference plane (65).

REFERENCES:
patent: 4704020 (1987-11-01), Murakami et al.
patent: 4999699 (1991-03-01), Sakamoto et al.
patent: 5461237 (1995-10-01), Wakamoto et al.
patent: 5475490 (1995-12-01), Hirukawa et al.

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