Programmed pulse electroplating process

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...

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Details

205125, 205296, 205298, 205920, C25D 518

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active

060713984

ABSTRACT:
The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.

REFERENCES:
patent: 4666567 (1987-05-01), Loch
patent: 4975159 (1990-12-01), Dahms
patent: 5068013 (1991-11-01), Bernards et al.
patent: 5486280 (1996-01-01), Bullock, IV et al.
George W. Jernstedt, Better Deposits At Greater Speeds By PR Plating, Plating, Jul., 1948.

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