Programmed material consolidation processes for protecting...

Details Programmed material consolidation processes for protecting... Programmed material consolidation processes for protecting...

2006-08-01

2006-08-01

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S106000, C438S127000

Reexamination Certificate

active

07084012

ABSTRACT:
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies includes selectively altering a state of substantially unconsolidated material adjacent to an intermediate conductive element. Selective alteration of the state of the substantially unconsolidated material may be effected by way of a programmed material consolidation process, such as stereolithography. Programmed material consolidation may be accompanied by a feature-recognition technique, such as machine vision. When a programmed material consolidation process is effected, a plurality of adjacent, mutually adhered regions, such as layers, of a protective structure may be formed.

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