Programmed material consolidation methods for fabricating...

Details Programmed material consolidation methods for fabricating... Programmed material consolidation methods for fabricating...

2006-11-21

2006-11-21

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S831000, C029S846000, C438S597000, C438S598000, C438S106000

Reexamination Certificate

active

07137193

ABSTRACT:
Methods for fabricating semiconductor device components include use of programmed material consolidation processes to form the substrates or conductive elements thereof. The features that are formed by such processes may include multiple adjacent, mutually adhered regions. A machine vision system may be used so that the programmed material consolidation system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which an element is to be fabricated.

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