Programmable thermal emulator test die

Details Programmable thermal emulator test die Programmable thermal emulator test die

1986-03-20

1988-03-08

Eisenzopf, Reinhard J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

219209, 357 28, 374 44, 374152, G01N 2518

Patent

active

047301600

ABSTRACT:
A novel test die for emulating the thermal characteristics of functional product dies includes a plurality of concentric emulator ring configurations fabricated about the die center, each having a plurality of heating resistors approximately forming a rectangle, a plurality of sense diodes located in proximity to the heating resistors and a plurality of hot spot resistors located in proximity to both the heating resistors and the sense diodes. Metallic interconnections are formed on the die which selectively provide each of the heating resistors and hot spot resistors with excitation signals and present signals from the sense diodes indicative of the voltage thereacross.

REFERENCES:
patent: 3781515 (1973-12-01), Morris, Jr. et al.
IBM Technical Disclosure Bulletin, Reilly et al., "Self Contained Chip Heater", vol. 14, No. 6, Nov. 1971, p. 1770.
IBM Technical Disclosure Bulletin, Yu, "Self-Heating Test Chip for Reliability Life Test", vol. 25, No. 7B, Dec. 1982, p. 3651.

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