Programmable substrate support for a substrate positioning syste

Details Programmable substrate support for a substrate positioning syste Programmable substrate support for a substrate positioning syste

1998-03-30

2000-06-20

Morse, Gregory A.

Material or article handling

Horizontally swinging load support

901 40, 414937, 294 641, B25J 1506

Patent

active

060770260

ABSTRACT:
A programmable substrate support including a first substrate support that mates with a second substrate support to enable automatic switching between different types of substrates. The first substrate support is configured to support a first type of substrate and to mount to a substrate positioning system to enable handling of substrates of the first type. The second substrate support is configured to support a second type of substrate, and is further configured to mate with the first substrate support to form a mated configuration. The mated configuration enables the substrate positioning system to handle substrates of the second type. In a semiconductor wafer processing embodiment, the first substrate support is an end effector capable of handling wafers of a first size, such as 200 millimeter (mm) wafers, and the second substrate support is another end effector capable of handling wafers of a second size, such as 300 mm wafers. Of course, any size and type of substrate is contemplated. The first and second end effectors include complementary couplers that enables the second end effector to mount on top of the first end effector in the mated configuration. The complementary couplers may further include locating features to enable repeatable alignment between the end effectors.

REFERENCES:
patent: 4449885 (1984-05-01), Hertel et al.
patent: 4971512 (1990-11-01), Lee et al.

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