Programmable multi-chip module

Details Programmable multi-chip module Programmable multi-chip module

2005-05-24

2005-05-24

Wilson, Christian (Department: 2824)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S107000, C438S125000, C257S723000

Reexamination Certificate

active

06897078

ABSTRACT:
A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.

REFERENCES:
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4652974 (1987-03-01), Ryan
patent: 5191404 (1993-03-01), Wu et al.
patent: 5311053 (1994-05-01), Law et al.
patent: 5321277 (1994-06-01), Sparks et al.
patent: 5321322 (1994-06-01), Verheyen et al.
patent: 5504354 (1996-04-01), Mohsen
patent: 5642262 (1997-06-01), Terrill et al.
patent: 5670824 (1997-09-01), Weinberg
patent: 5694040 (1997-12-01), Plagens
patent: 5814847 (1998-09-01), Shihadeh et al.
patent: 5926369 (1999-07-01), Ingraham et al.
patent: 5973340 (1999-10-01), Mohsen
patent: 6111756 (2000-08-01), Moresco
patent: 6194897 (2001-02-01), Fukunaga
patent: 6229307 (2001-05-01), Umehara et al.
patent: 6256206 (2001-07-01), Van Campenhout
patent: 6377464 (2002-04-01), Hashemi et al.
patent: 6392296 (2002-05-01), Ahn et al.
patent: 6477054 (2002-11-01), Hagerup
patent: 6642064 (2003-11-01), Terrill et al.
patent: 6677668 (2004-01-01), Lin
patent: 6700196 (2004-03-01), Kautz et al.
patent: 6707141 (2004-03-01), Akram
patent: 20020079568 (2002-06-01), Degani et al.
patent: 0241770 (1992-07-01), None
Cotton et al., Design and Development Challenges for Complex Laminate Multichip Modules,International Conf. Multichip Modules,(Apr. 1997) 196.*
Campbell, P., “Miniature Magnetic Encoder”, Machine Design vol. 62, Part 5, pp. 105-108 (Mar. 8, 1990).

Affiliated with

Also associated with

Rating

Programmable multi-chip module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Programmable multi-chip module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Programmable multi-chip module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3451130