Programmable microsystems in silicon

Details Programmable microsystems in silicon Programmable microsystems in silicon

1995-01-03

1997-09-09

Sparks, Donald

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular signal path connections

257209, 257211, 438106, 438129, H01L 2706, H01L 2170

Patent

active

056659890

ABSTRACT:
An integrated circuit fabrication method and apparatus to improve the design cycle time for implementing an electrical system in silicon. The invention uses predefined core, or cell, patterns to provide some of the functionality for a system design. The cores are interconnected using thick wire conductors and solder bumps so that conductive paths that do not lie within the plane of the substrate of the silicon chip containing the cores are provided. Since the conductive paths do not lie on the process surface of the chip, the topographical design of the chip is not affected by the interconnections. Further, the thick wire conductors result in essentially zero propagation delay so that timing design errors are greatly reduced, or eliminated, in the design cycle. The invention allows for a rapid prototype of the entire design to be produced early in the design cycle. In one embodiment, customer logic is arranged around the periphery of the substrate while the core cells are in the middle of the substrate.

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