Programmable load circuit for use in automatic test equipment

Miscellaneous active electrical nonlinear devices – circuits – and – Gating – Utilizing two electrode solid-state device

Reexamination Certificate

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Details

C327S587000

Reexamination Certificate

active

06211723

ABSTRACT:

FIELD OF THE INVENTION
The present invention relates to an automatic tester. More particularly, the present invention relates to an automatic tester with a programmable load circuit that generates a source or sink current to test the output pins of a device under test.
BACKGROUND
Test equipment is typically used to determine whether a device under test (“DUT”) follows a set of timing and drive strength specifications. Accordingly, testing accuracy plays a vital role in the design of test equipment because a discrepancy in measurements can result in an incorrect classification of a DUT. For example, in some testing environments, provided a DUT follows a set of predetermined specifications, the DUT is categorized as a valid device for sale. Typically, to pass as a valid device each pin of a given DUT must satisfy both timing and drive strength requirements. Typical timing requirements include valid time, hold time, and setup time. Typical drive strength requirements include driving an output to a predetermined voltage despite an opposing current source load.
Prior art testers use a diode bridge system to determine the drive strength of a DUT output. The diode bridge allows a tester to determine the high-state drive capability of a DUT by sinking current out of the DUT when the DUT is driving an output pin to a high voltage. Alternatively, the diode bridge allows a tester to determine the low-state drive capability of a DUT by sourcing current into the DUT when the DUT is driving an output pin to a low voltage.
FIG. 1
illustrates a prior art testing system. In particular, test system
100
is used to determine the drive strength of a DUT pin coupled to output Vd
130
. To test the drive strength of the DUT pin, system
100
compares the voltage on input voltage switch (“Vs”)
110
to the voltage on output Vd
130
via the diode bridge consisting of Schottky diodes D
1
, D
2
, D
3
, and D
4
—the diodes are typically forward biased during a 0.5 voltage drop. If the voltage on Vd
130
is greater than the voltage on Vs
110
, system
100
sinks current away from the DUT via current source (“Is”)
125
. Thus, testing the drive strength of the DUT when the DUT is driving an output pin to a high voltage. On the other hand, if the voltage on Vd
130
is less than the voltage on Vs
110
, system
100
injects current into the DUT via current source (“Is”)
120
. Thus, testing the drive strength of the DUT when the DUT is driving an output pin to a low voltage.
During the testing of a DUT pin coupled to output Vd
130
, system
100
sets Vs
110
to the switch point voltage of the DUT and closes both switches S
121
and S
126
. As illustrated in
FIG. 1
, Vs
110
is coupled to buffer
115
which, in turn, is coupled to an intermediate node (N
112
) of the diode bridge. Typically, buffer
115
is a unity buffer that transfers the voltage on Vs
110
to node N
112
. Thus, Vs
110
is compared to Vd
130
via the intermediate nodes of the diode bridge. In particular, as the voltage on Vd
130
increases past Vs
110
, diodes D
4
and D
1
are forward biased while diodes D
3
and D
1
are reverse biased. Thus, Is
125
sinks current out of Vd
130
. Alternatively, as the voltage on Vd
130
decreases below Vs
110
, diodes D
3
and D
2
are forward biased while diodes D
4
and D
1
are reverse biased. Thus, Is
120
injects current into Vd
130
.
System
100
allows prior art testers to accurately test the drive strength of slow speed devices. Prior art testers, however, create numerous disadvantages during the testing of high speed or low power devices. For example, one disadvantage of system
100
is evident during the testing of low power devices. In particular, during power measurements of a low power DUT coupled to node Vd
130
, the leakage in the Schottky diodes (D
1
-D
4
) results in a data offset of the power supply current measurement. Thus, system
100
incorrectly classifies low power devices as having a high direct current (“DC”) leakage.
Another disadvantage of prior art testers results form the inconsistent loading characteristics of system
100
. Specifically, if Vd
130
is coupled to an input/output (“I/O”) pin of a DUT, system
100
operates in two different modes. If the I/O pin is operating as an input, system
100
switches S
121
and S
126
to an off position. If the I/O pin is operating as an output, however, system
100
switches S
121
and S
126
to an on position. The transition between the two modes results in nodes N
113
and N
111
floating to an undetermined value, thus resulting in a timing error during the testing of high speed devices.
For example, Vd
130
is coupled to an I/O pin of a DUT with a 0 to 5 voltage swing. System
100
sets Vs to 2.5 volts. As previously described, during the input testing of the DUT, system
100
moves switches S
121
and S
126
to an off position. Thus, resulting in node N
113
floating to a voltage value between 2 and 5 volts. Subsequently, during the drive strength testing of node Vd
130
, system
100
moves switches S
121
and S
126
to an on position. During the initial low-to-high transition of the DUT output, D
4
turns on and the capacitive loading of node N
113
is transferred to node Vd
130
. However, on a subsequent low-to-high transition of the DUT output, D
4
remains off because node N
113
was previously driven to a high stage, thus the capacitive loading of node N
113
is not transferred to node Vd
130
. The inconsistent transfer of capacitive loading results in a timing error.
FIG. 1
also illustrates the timing errors created by the inconsistent transfer of capacitive loading by system
100
. In particular chart
105
outlines the voltage transitions of output Vd
130
during the two different modes of system
100
. The horizontal axis of timing chart
105
shows time (“t”). The vertical axis of timing chart
015
shows the voltage level on output Vd
130
.
Prior to time period
106
, the DUT pin coupled to output Vd
130
is used as an input. Accordingly, system
100
moves switches S
121
and S
126
to the off position. Subsequently, system
100
is used to determine the drive strength of the DUT pin coupled to Vd
130
. Accordingly, system
100
moves switches S
121
and S
126
to the off position. As previously described, the initial low-to-high transition of output Vd
130
incurs additional capacitive loading. Thus, as illustrated in timing chart
105
, voltage rise time
150
is slower than voltage rise time
155
. In prior art slow speed devices the difference in rise times is considered negligible. In high speed devices, however, the tester generated difference in rise time may lead to an incorrect characterization of a high speed device as an invalid device.
Yet another disadvantage of prior art testers results from using system
100
as a low voltage driver.
FIG. 2
illustrates a prior art low voltage driver used to drive wave forms on a DUT input coupled to output Vd
230
. System
200
includes input Vtest
255
coupled to driver
220
which, in turn, is coupled to resistor (R
215
). R
215
is also coupled to load
210
(corresponding to system
100
) and output VD
230
. Typically, driver
220
is a unity buffer that transfers the value on input Vtest
255
to node N
211
. System
200
creates voltage swings on output Vd
230
by controlling the values of input Vtest
225
, R
215
, and the switching times of S
121
and S
126
.
For example, to generate a low voltage output on a DUT input. System
200
sets Vtest
225
to 50 milli-volts (“mV”), R
215
to 50 ohms, and VS
110
to −2 volts—thus ensuring that system
100
only performs a current sink. System
200
also sets both Is
120
and Is
125
to 2 milli-amperes (“mA”). As system
200
, moves switches S
121
and S
126
between the on and off position, either 2 mA of current is sunk out off Vd
230
or Vd
230
is left floating. Thus, resulting in an output on VD
230
that transitions between −0.05 volts an 0.05 volts.
As previously described, the switching of S
121
and S
126
creates inconsistent transfer of capacitive load

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