Wells – Processes – Placing or shifting well part
Reexamination Certificate
2006-07-11
2006-07-11
Bagnell, David (Department: 3672)
Wells
Processes
Placing or shifting well part
C166S206000, C166S236000, C166S242100
Reexamination Certificate
active
07073601
ABSTRACT:
The present invention provides an encapsulation for housing instrumentation lines, control lines, or instruments downhole. In one use, the encapsulation resides between an expandable downhole tool, such as an expandable sand screen, and the wall of the well bore. The encapsulation is specially profiled to allow the downhole tool to be expanded into the wall of the wellbore without leaving a channel outside of the tool through which formation fluids might vertically migrate. The encapsulation is useful in both cased hole and open hole completions.
REFERENCES:
patent: 3844345 (1974-10-01), Evans et al.
patent: 4569392 (1986-02-01), Peterman
patent: 6173788 (2001-01-01), Lembcke et al.
patent: 6446723 (2002-09-01), Ramos et al.
patent: 6457518 (2002-10-01), Castano-Mears et al.
patent: 6789621 (2004-09-01), Wetzel et al.
patent: 6799637 (2004-10-01), Schetky et al.
patent: 6805202 (2004-10-01), Gillespie et al.
patent: 6817410 (2004-11-01), Wetzel et al.
patent: 6848510 (2005-02-01), Bixenman et al.
patent: 6854522 (2005-02-01), Brezinski et al.
patent: 6863131 (2005-03-01), Richard
patent: 6877553 (2005-04-01), Cameron
patent: 2001/0047871 (2001-12-01), Johnson et al.
patent: 2002/0088744 (2002-07-01), Echols et al.
patent: 2004/0104026 (2004-06-01), Johnson et al.
patent: 2391567 (2004-02-01), None
Bagnell David
Bomar Shane
Patterson & Sheridan L.L.P.
Weatherford / Lamb, Inc.
LandOfFree
Profiled encapsulation for use with instrumented expandable... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Profiled encapsulation for use with instrumented expandable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Profiled encapsulation for use with instrumented expandable... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3558591