Profile control photoresist

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

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Details

204192E, 427 39, 430313, 430314, B05D 136, B05D 304

Patent

active

044078501

ABSTRACT:
Anisotropic etching of thick photoresist under plasma conditions to achieve a vertical side wall with or without undercutting is accomplished by operating at a low excitation frequency, a pressure in the range of 0.3 to 2 Torr and a controlled concentration of active species.

REFERENCES:
Moran et al, "High Resolution, Step Profile, Resist Patterns" Bell System Technical Journal, May, Jun. 1979, vol, 58, No, 5, pp. 1027-1036.

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