Production system for manufacturing semiconductor devices

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Details

364164, 364150, 29574, G06F 1546, G05B 1302, G06G 764, H01L 2166

Patent

active

045716854

ABSTRACT:
A production system for manufacturing semiconductor devices comprises apparatus for making a semiconductor wafer during a first process step. A plurality of semiconductor devices, or semiconductor chips are arranged and incorporated in the wafer. A second apparatus processes the semiconductor material in a second process step during production. An inspection apparatus provides an automatic inspection function between the first and the second process steps. The inspection result is automatically estimated by the inspection apparatus, with respect to a specification value and a central value within the specification value. The inspection apparatus is connected to a third apparatus for carrying out at least one further manufacturing step after the second process step. Accordingly, if the estimate of the inspection apparatus is within the specification value, but out of adjustment with respect to the central value. An instruction signal can be automatically sent to either the second or the third manufacturing apparatus, to compensate in the direction of the central value.

REFERENCES:
patent: 3461547 (1969-08-01), Curcio
patent: 3618199 (1971-11-01), King et al.
patent: 3751647 (1973-08-01), Maeder et al.
patent: 3946212 (1976-03-01), Nakao et al.
patent: 4151589 (1979-04-01), Ross
patent: 4213175 (1980-07-01), Kurihara

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