Production process for surface-mounting ceramic LED package,...

Details Production process for surface-mounting ceramic LED package,... Production process for surface-mounting ceramic LED package,...

2011-01-18

2011-01-18

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Mesa formation

C438S025000, C438S022000, C438S024000, C257S079000, C257S081000, C257SE51019

Reexamination Certificate

active

07871842

ABSTRACT:
The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.

REFERENCES:
patent: 5861670 (1999-01-01), Akasaki
patent: 6300576 (2001-10-01), Nakamura et al.
patent: 6548895 (2003-04-01), Benavides et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 7279724 (2007-10-01), Collins et al.
patent: 7718456 (2010-05-01), Maeda et al.
patent: 2008/0023713 (2008-01-01), Maeda et al.
patent: 1873131 (2008-01-01), None
patent: 2005-086051 (2005-03-01), None
patent: 2006-100441 (2006-04-01), None
patent: 2006-185986 (2006-07-01), None
patent: 2006-261290 (2006-09-01), None
patent: 2006-332381 (2006-12-01), None
patent: 2007-095973 (2007-04-01), None
patent: 2002017401 (2002-02-01), None
International Search Report for International Application No. PCT/US2009/059490 Dated Feb. 8, 2010.

Affiliated with

Also associated with

Rating

Production process for surface-mounting ceramic LED package,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Production process for surface-mounting ceramic LED package,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Production process for surface-mounting ceramic LED package,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2705718