Production process for surface-mounting ceramic LED package,...

Details Production process for surface-mounting ceramic LED package,... Production process for surface-mounting ceramic LED package,...

2011-05-17

2011-05-17

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Mesa formation

C438S025000, C438S022000, C438S024000, C257S079000, C257S081000, C257SE51019

Reexamination Certificate

active

07943408

ABSTRACT:
The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.

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