Production process for manufacturing such semiconductor package

Details Production process for manufacturing such semiconductor package Production process for manufacturing such semiconductor package

2006-10-04

2008-11-11

Chambliss, Alonzo (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C438S127000, C257S672000, C257S676000, C257S693000, C257S784000, C257SE23052, C361S772000, C361S773000, C361S813000

Reexamination Certificate

active

07449370

ABSTRACT:
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that a bottom surface of the semiconductor chip is in contact with the plate-like mount. The semiconductor package also includes at least one lead element having an outer portion arranged to be flush with the plate-like mount, and an inner portion deformed and shaped to overhang the semiconductor chip such that an inner end of the lead element is spaced apart from the top surface of the semiconductor chip. The semiconductor package further includes a bonding-wire element bonded at ends thereof to the electrode of the semiconductor chip and the inner end of the lead element, an enveloper sealing and encapsulating the plate-like mount, the semiconductor chip, the inner portion of the lead element, and the bonding-wire element.

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Japanese Office Action issued on Dec. 18, 2007.

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