Coating processes – Electrical product produced – Transparent base
Patent
1985-10-22
1987-05-05
Smith, John D.
Coating processes
Electrical product produced
Transparent base
427 58, 427266, 427 96, 427259, B05D 512
Patent
active
046631925
DESCRIPTION:
BRIEF SUMMARY
DESCRIPTION
FIELD OF THE INVENTION
The present invention relates to a process for preparing a flexible transparent electrode substrate. The object of the present invention is to provide a process for easily and economically preparing a flexible transparent electrode substrate having good properties in surface strength, abrasion resistance, surface resistance and the like.
BACKGROUND OF THE INVENTION
There has been proposed the use of a flexible transparent electrode substrate for electrodes of a liquid crystal display, an electroluminescence display, an electrophotographic recording medium, an electrophoretic recording medium, an electron beam recording medium, a transparent switch, a connector and the like.
The following process have been utilized for the production of such a flexible transparent electrode substrate: A thin film of a metal, such as gold, silver, palladium and the like; or a metal oxide, such as stannum oxide, indium oxide, antimony oxide, cadmium stannum oxide and the like is formed on plastic transparent film by way of a vacuum evaporation process, a sputtering process and a masking layer by a resist ink or a photoresist is formed thereon in the part of desirable electrode pattern. Then, the unnecessary part of the metal thin film or metal oxide thin film is removed by way of a wet or dry etching process, followed by removing the masking layer to obtain a flexible transparent electrode substrate.
However, the transparent electrode substrate obtained by the above process has the following defects. metal thin film or metal oxide thin film is weak in surface strength and also a part without forming the metal thin film or metal oxide thin film i.e. a part which the transparent plastic film is exposed is weak in surface strength. thin film is not adhered tightly to the transparent plastic film because the thin film is directly adhered to the transparent plastic film.
Furthermore, the above process also have the following defects because of the etching process mentioned above. Thus; process when the masking layer is made by a resist ink. photosensitive resin, print and develop of pattern, removal of photoresist and the like is required for making the masking layer by a photoresist. the snapping of the pattern occurs often, since the pattern becomes thin by means of a side-etching when the etching is carried out. masking layer is made. It is difficult to control technically the etching width. thin film or metal oxide thin film has a stain or damage on the surface when the masking layer is removed. photoresist is expensive. liquid.
Because of the above problems, especially problems (1) and (2), the transparent electrode substrate obtained by the above process can only be used for a limited field or it requires a further treatment, for example by coating it with a protective film in practice. For dissolving the above problems, Japanese patent publication (unexamined) No. 10450/1981 discloses a process in which a hard organic treating layer obtained from a silicon resin, an acrylate resin formed from a compound having acryloyl groups, a vinyl polymer formed from a compound having vinyl groups, etc. is placed between the metal thin film or metal oxide thin film and the transparent plastic film. However, even in this process, it has possibility that the treating layer is affected by an alkali solution or an organic solution used in an etching process. As the result, a material used for the treating layer must be limited to one which is not affected by the alkali solution or the organic solution. Accordingly, there has not been substantially solved the above problems, especially there have been remained the problems associated with the etching process.
DESCRIPTION OF THE INVENTION
As the result of the intensive study for dissolving the above problems in the prior art by the inventors of the present invention, it has been found that, instead of the above etching process in the prior art, a process, in which a coating layer comprising a water-soluble material is formed on a part which the tra
REFERENCES:
patent: 3985597 (1976-10-01), Zielinski
patent: 4242438 (1980-12-01), Sato
patent: 4252841 (1981-02-01), Kinuzawa
patent: 4326929 (1982-04-01), Minezaki
Hatakeyama Hiroshi
Matsumura Kozo
Nakagawa Eiji
Ogawa Masayuki
Dang Vi Duong
Nissha Printing Co. Ltd.
Smith John D.
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