Production of semiconductor devices

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 98, 427264, 427271, 427307, 156633, 156634, 156644, 156656, 156668, B05D 512, H05K 300

Patent

active

041185234

ABSTRACT:
A method of forming very small diameter holes in a flexible substrate by coating both sides of substrate with metal layers; etching layers and substrate at places where holes required, removing small ring of the metal layers surrounding holes to remove any overhang of metal; and plating walls of holes and providing electrical conduction with said layers.

REFERENCES:
patent: 3268653 (1966-08-01), McNutt
patent: 3620933 (1971-11-01), Grunwald
patent: 3702284 (1972-11-01), Merkenschlager
patent: 3937857 (1976-02-01), Brunnett
patent: 4023999 (1977-05-01), Lindberg

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