Production of notchless wafer

Details Production of notchless wafer Production of notchless wafer

1998-03-09

1999-11-30

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451 44, 451 54, 451 69, 451 70, 125 1302, B28B 100

Patent

active

059932929

ABSTRACT:
A shallow notch 1 as a tentative mark is engraved on a periphery of an ingot at a position corresponding to a predetermined crystal orientation in the step of grinding the periphery of the ingot. After the ingot is sliced to wafers, a mark 2 for indication of a crystal orientation is carved on a sliced wafer at a position determined on the basis of the notch 1 by laser marking. Thereafter, the wafer is chamfered to a round shape, and the notch 1 is removed by the chamfering. Since a part where the mark 2 shall be carved is determined on the basis of the notch 1, the mark 2 is efficiently carved on the wafer without the necessity of subjecting each wafer to an X-ray analyzer.

REFERENCES:
patent: 4084354 (1978-04-01), Grandia et al.
patent: 5227339 (1993-07-01), Kishii
patent: 5405285 (1995-04-01), Hirano et al.
patent: 5439723 (1995-08-01), Miyashita et al.
patent: 5679060 (1997-10-01), Leonard et al.
patent: 5792566 (1998-08-01), Young et al.
patent: 5927263 (1999-07-01), Muramatsu

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