Production of metal clad laminates

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156313, 156323, 156324, 428901, 264345, C09J 502, H05K 300

Patent

active

044103883

ABSTRACT:
Variations in performance of metal clad reinforced resin laminates may be minimized by aging the laminates in a high-temperature, high-humidity atmosphere subsequent to the curing step. The products are useful for the production of printed circuit wiring boards.

REFERENCES:
patent: 2149812 (1939-03-01), Lindstrom
patent: 2553192 (1951-05-01), Himdall
patent: 2830924 (1958-04-01), Witt
patent: 3352960 (1967-11-01), McLaughlin
patent: 3988408 (1976-10-01), Haining et al.

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