Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-10-18
2005-10-18
Aftergut, Jeff H. (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S288000, C156S289000, C270S052090
Reexamination Certificate
active
06955740
ABSTRACT:
A laminate to be used in the manufacture of printed circuit boards is formed by contacting one surface of a layer of a conductive foil (e.g. copper foil) with protective-carrier sheeting (e.g., aluminum foil) and the other surface of the conductive foil with a dielectric layer (e.g., prepreg). The contacted layers are stacked and cut to desired dimensions. The process is performed without use of adhesive or mechanical attachment. Consequently, contamination and the occurrence of imperfections in the conductive foil of a laminate to be used in a printed wiring board can be substantially reduced.
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Rapuano Joseph C.
Samevall Peter L.
Varul Ronny
Aftergut Jeff H.
Goff John L.
Mintz Levin Cohn Ferris Glovsky and Popeo P.C.
Polyclad Laminates, Inc.
LandOfFree
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