Production of integrated circuit chip packages prohibiting...

Details Production of integrated circuit chip packages prohibiting... Production of integrated circuit chip packages prohibiting...

2011-03-29

2011-03-29

Tran, Thien F (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S779000, C257S780000

Reexamination Certificate

active

07915732

ABSTRACT:
Methods for making, and structures so made for producing integrated circuit (IC) chip packages without forming micro solder balls. In one embodiment, a method may include placing a solid grid made from an organic material between the IC chip and the substrate. The grid provides a physical barrier between each of a plurality of Controlled Collapse Chip Connections, and thereby prevents the formation of micro solder balls between them, thus improving chip performance and reliability.

REFERENCES:
patent: 6238948 (2001-05-01), Ramalingam
patent: 6528345 (2003-03-01), Cook
patent: 2007/0026575 (2007-02-01), Subramanian et al.

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