Production of dielectric boards

Details Production of dielectric boards Production of dielectric boards

1987-10-09

1988-11-01

Zimmerman, John J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428674, 428677, 428687, 428935, B32B 1520

Patent

active

047819910

ABSTRACT:
Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.

REFERENCES:
patent: 3293109 (1966-12-01), Luce et al.
patent: 3998601 (1976-12-01), Yates et al.
patent: 4061837 (1977-12-01), Hutkin
patent: 4455181 (1984-06-01), Lifshin et al.
patent: 4468293 (1984-08-01), Polan et al.
patent: 4503112 (1985-03-01), Konicek
patent: 4564566 (1986-01-01), Jerlich et al.

Affiliated with

Also associated with

Rating

Production of dielectric boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Production of dielectric boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Production of dielectric boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-890449