Production of bubble-free electrical laminates

Details Production of bubble-free electrical laminates Production of bubble-free electrical laminates

1981-09-22

1983-06-14

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 736, 156 87, 156286, 1563074, 1563077, 156382, 264 69, 264258, 264344, 428901, B32B 3114

Patent

active

043881297

ABSTRACT:
Bubble- or void-free electrical laminates such as unclad or metal clad laminates are produced by impregnating a porous fibrous substrate with a solvent-free liquid resin capable of curing to a rigid state without producing a volatile by-product, combining a plurality of impregnated substrates to form a unitary member, allowing substantially all of entrapped air bubbles retained in the combination to disappear by dissolving into the liquid resin, and then curing the combination.

REFERENCES:
patent: 3291672 (1966-12-01), Sonneborn et al.
patent: 3746589 (1973-07-01), Reinke
patent: 3897588 (1975-07-01), Nohtomi

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