Production of aluminum material having an aluminum nitride layer

Details Production of aluminum material having an aluminum nitride layer Production of aluminum material having an aluminum nitride layer

1986-06-10

1987-10-06

Niebling, John F.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

148 203, 2504923, B05D 306

Patent

active

046982337

ABSTRACT:
Process for producing an aluminum material having an aluminum nitride surface layer which comprises implanting the surface of an aluminum substrate with nitrogen ions while maintaining a nitrogen atmosphere under reduced pressure in the vicinity of the surface of the aluminum substrate. The aluminum nitride modified layer contains substantially no impurities such as oxygen. It is a feature of this invention to perform ion implantation in a properly controlled nitrogen atmosphere at a proper degree of vacuum in the range of about 10.sup.-7 to 10.sup.-5 Torr.

REFERENCES:
patent: 3737343 (1973-06-01), Basseches et al.
patent: 3806380 (1974-04-01), Kitada et al.
patent: 4383178 (1983-05-01), Shibata et al.
patent: 4597808 (1986-07-01), Tachikawa et al.
patent: 4629631 (1986-12-01), Dearnaley

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