Colloid systems and wetting agents; subcombinations thereof; pro – Continuous or semicontinuous solid phase – The solid phase contains silica
Reexamination Certificate
2004-11-03
2010-10-12
Choi, Ling-Siu (Department: 1796)
Colloid systems and wetting agents; subcombinations thereof; pro
Continuous or semicontinuous solid phase
The solid phase contains silica
C521S050000
Reexamination Certificate
active
07812059
ABSTRACT:
The invention relates to a method for producing an aerogel that contains a filler and has an extremely low thermal conductivity. The aerogel moulded body contains an inorganic filler with a thermal conductivity of up to 0.5 Wm−1K−1.
REFERENCES:
patent: 4032105 (1977-06-01), Gritzner et al.
patent: 5086085 (1992-02-01), Pekala
patent: 5569513 (1996-10-01), Fidler et al.
patent: 6083619 (2000-07-01), Frank et al.
patent: 2004/0077738 (2004-04-01), Field et al.
patent: EP 1077097 (2001-02-01), None
patent: 1077097 (2001-02-01), None
patent: 0875905 (2001-06-01), None
patent: 04081243 (1992-03-01), None
patent: WO 97/17308 (1997-05-01), None
patent: WO 03/009227 (2003-02-01), None
R.W. Pekala, et al.; “Aerogels derived from multifunctional organic monomers”; Journal of Non-Crystalline Solids 145 (1992) 90-98.
R. W. Pekala, et al.; “Carbon Areogels and Xerogels”; Mat. Res. Soc. Symp. Proc; vol. 270, 1992, Materials Research Society.
R. Petricevic, et al.; “Structure of carbon aerogels near the gelation limit of the resorcinol-formaldehyde precursor”; Journal of Non-Crystalline Solids 225 (1998) 41-45.
Brück Sabine
Ratke Lorenz
Choi Ling-Siu
Deutsches Zentrum fur Luft -und Raumfahrt e.V.
Harness Dickey & Pierce PLC
Wang Chun-Cheng
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