Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-01-31
1999-11-09
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
26427217, H05K 300
Patent
active
059806834
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This present invention relates to a process for the manufacture of a carrier element module, including one carrier element and at least one IC chip, more particularly, a macro-chip with large dimensions, which is preferably provided for use in chip cards or other data carrier cards.
DESCRIPTION OF RELATED ART
Chip cards which have been used recently for the processing of information, for example multi-functional chip cards or telephone cards generally consist of a single or multiple layer insulated carrier element module, which carries the integrated semi-conductor circuit chip in a recess in a carrier element, for example, or located on the surface of the carrier element.
The wiring of the chip with the external contacts can be carried out according to the method known to the art from patent document DE-C-3029667, using a form of contacting technology known as "wire bonding". According to this process, the connection points of the chip are connected with the contact areas of the carrier element by means of, for example, fine gold wires.
"Tape Automated Bonding" (TAB) is known to the art from U.S. Pat. No. 4,474,292 as a contacting possibility between the chip and the contact areas of the carrier element. To provide contact between the chip and the appropriate wiring, the wiring patterns contain contact fingers, which lead in the form of what are known as a contact spider in the direction from the outside towards the inside of the chip. The chip is then located on the ends of these contact fingers of the circuit, by means of ultrasonic welding.
A further possibility for contacting is by means of "plated through holes" (PTH), as is described in UK patent application GB 2 081 974 A.
In the further application (reference: . . . , GE994016) the use or what is known as C4 technology is proposed to produce an electrical connection between an IC and a carrier element, which is provided for use in chip cards or other data carrier cards. This enables a high integration of the IC with a correspondingly large number of contacts for communication between the IC and its external environment.
After contacting between the chip and carrier, the chip is encapsulated in the carrier or coated on the carrier with a cast resin drop in order to cut out environmental influences. The essentially convex shape formed by the cast resin coating has proved to be problematic here, however, in particular in the manufacture of chips with large surfaces. In particular in the coating of large surface and also, with respect to the height to surface ratio, relatively flat chips, the convex and relatively undefined drop shape remaining after curing requires reworking, e.g. by means of an abrasive process, in order to achieve smaller overall heights.
All methods known to the art for the manufacturing of carrier elements for ICs share the characteristic, that chips with great dimensions (macro chips) cannot be used or can be used only at great expense. As a result of this, the manufacturing of mass produced articles is not possible with maximum storage density, such as chip cards and flexible circuit boards.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to find a process for the manufacture of carrier element modules with ICs which enables the use of chips with great dimensions (macro chips).
The object of the present invention is solved by means of the method according to the independent patent claim 1.
The manufacturing process according to the present invention also allows the manufacture of carrier element modules with large surface chips (e.g. with high storage density), as are required as the result of the increasing information requirement with growing applications possibilities, in particular of chip cards. This is possible as a result of being able to manufacture modules with a small and defined overall height.
The use of the transfer moulding process with a transfer moulding compound with predetermined features makes it possible, as a result of the definable shape of the chip coatin
REFERENCES:
patent: 4514752 (1985-04-01), Engel et al.
patent: 4927580 (1990-05-01), Nasu et al.
patent: 5273475 (1993-12-01), Oshikawa
patent: 5386342 (1995-01-01), Rostoker
Beck Wolfgang
Braun Reinhold
Diemer Roland
Druschke Frank
Elsner Gerhard
Hesse K. O.
International Business Machines - Corporation
Lorin Francis J.
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