Production method of suspension board with circuit

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S830000, C029S832000, C029S840000, C029S852000, C174S250000, C174S255000, C174S258000, C174S260000

Reexamination Certificate

active

07571540

ABSTRACT:
A method of producing a suspension board with circuit, wherein after an insulating base layer is formed on a metal supporting board, a conductive pattern including a ground wiring pattern and a signal wiring pattern is formed on the insulating base layer. Then, an insulating cover layer to cover the conductive pattern is formed on the insulating base layer in such a manner that a first cover opening portion and a second cover opening portion are formed in the insulating cover layer. Then, an electrolytic plating layer is formed on a surface of the ground terminal exposed from the first cover opening portion and on a surface of the ground connecting portion exposed from the second cover opening portion, feeding electric power from the ground wire. Thereafter, a metal filling layer is formed in the base opening portion to electrically connect the ground connecting portion and the metal supporting board.

REFERENCES:
patent: 5657186 (1997-08-01), Kudo et al.
patent: 5858518 (1999-01-01), Omote et al.
patent: 6096482 (2000-08-01), Omote et al.
patent: 6100582 (2000-08-01), Omote et al.
patent: 6388201 (2002-05-01), Yamato et al.
patent: 6395633 (2002-05-01), Cheng et al.
patent: 7272889 (2007-09-01), Aonuma et al.
patent: 2002/0007961 (2002-01-01), Yamato et al.
patent: 2005/0282088 (2005-12-01), Aonuma et al.
patent: 7-231169 (1995-08-01), None
patent: 8-111015 (1996-04-01), None
patent: H10-265572 (1998-10-01), None
patent: 2001-339967 (2001-12-01), None
patent: 2001-352137 (2001-12-01), None
patent: 2006-12205 (2006-01-01), None

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