Production method of suspension board with circuit

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S830000, C029S832000, C029S840000, C438S678000, C438S687000

Reexamination Certificate

active

11156607

ABSTRACT:
A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer4having a base opening portion3is formed on a metal board2at a ground terminal13forming position, and a thin metal film5is formed on the metal board2exposed in the base opening portion3and on the insulating base layer4. Then, a conductive pattern7is formed on the thin metal film5. Then, an insulating cover layer9covering the conductive pattern7and having a cover opening portion8which correspond in position to the base opening portion3is formed on the insulating base layer4. Then, a metal board opening portion11from which the base opening portion3and the insulating base layer4around it are exposed is formed in the metal board2. Then, an electrolytic plating layer12is formed on each side of the conductive pattern7exposed in the cover opening portion8, feeding electric power from the conductive pattern7, and a metal filling layer14is formed in the metal board opening portion11, to allow the electrolytic plating layer12and the metal board2to be conductive with each other.

REFERENCES:
patent: 5858518 (1999-01-01), Omote et al.
patent: 6096482 (2000-08-01), Omote et al.
patent: 6100582 (2000-08-01), Omote et al.
patent: 6395633 (2002-05-01), Cheng et al.
patent: HEI 10-265572 (1998-10-01), None

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