Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-06-20
2011-10-11
Dang, Trung Q (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000, C438S118000, C257SE21519
Reexamination Certificate
active
08034659
ABSTRACT:
To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product60in which a dicing tape9, an adhesive layer3, and a semiconductor wafer6are stacked in this order so that a circuit surface6aof the semiconductor wafer6may face the dicing tape9side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface6afrom a rear surface6bof the semiconductor wafer6. At least the semiconductor wafer6and the adhesive layer3are cut in the thickness direction of the layered product60. The dicing tape9is cured to peel off the dicing tape9and the adhesive layer3. A projection electrode4of a semiconductor chip26is aligned with a wiring12of a wiring substrate40. The wiring substrate40and the semiconductor chip26are bonded via an adhesive layer23so that the wiring12and the projection electrode4may be electrically connected to each other.
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Enomoto Tetsuya
Hatakeyama Keiichi
Nagai Akira
Yasuda Masa'aki
Dang Trung Q
Griffin & Szipl, P.C.
Hitachi Chemical Company Ltd.
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